Applied Materials社の請求項 #557

5976993
Applied Materials
A process for depositing a film on a substrate disposed in a processing chamber, said process comprising the steps of: (a) flowing a process gas into the processing chamber; (b) forming an inductively-coupled plasma from said process gas using only RF energy applied to a coil disposed about the processing chamber; (c) depositing a first layer of the film over the substrate by maintaining the application of said RF energy for a first period of time; (d) applying electric energy to a first electrode and a second electrode while maintaining the application of said RF energy, wherein the substrate is disposed on said second electrode; and (e) depositing a second layer of the film over said first layer by maintaining the application of said electric energy and said RF energy for a second period of time.